Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922955 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Dioscoro A. Merilo, Lionel Chien Hui Tay | 2018-03-20 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh | 2018-01-09 |