Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho | 2018-01-09 |