Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2018-10-23 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, HeeJo Chi, JunMo Koo, Zigmund Ramirez Camacho | 2018-01-09 |