Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2018-10-23 |