Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2018-10-23 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |