Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2018-10-23 |
| 10068862 | Semiconductor device and method of forming a package in-fan out package | Arnel Senosa Trasporto | 2018-09-04 |
| 10043733 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Linda Pei Ee Chua | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Linda Pei Ee Chua | 2018-02-13 |