Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068843 | Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die | — | 2018-09-04 |
| 10043733 | Integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2018-02-13 |
| 9875911 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Yaojian Lin, Jun Mo Koo, HeeJo Chi | 2018-01-23 |