JK

Jun Mo Koo

SC Stats Chippac: 1 patents #23 of 69Top 35%
Overall (2018): #355,195 of 503,207Top 75%
1
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
9875911 Semiconductor device and method of forming interposer with opening to contain semiconductor die Reza A. Pagaila, Yaojian Lin, HeeJo Chi 2018-01-23