Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163747 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Yaojian Lin | 2018-12-25 |
| 10083916 | Semiconductor device and method of forming stress relief layer between die and interconnect structure | Il Kwon Shim, Yaojian Yaojian | 2018-09-25 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2018-02-13 |