Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083916 | Semiconductor device and method of forming stress relief layer between die and interconnect structure | Il Kwon Shim, Seng Guan Chow | 2018-09-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083916 | Semiconductor device and method of forming stress relief layer between die and interconnect structure | Il Kwon Shim, Seng Guan Chow | 2018-09-25 |