Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043733 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Byung Tai Do | 2018-02-13 |