Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134664 | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | Minkyung Kang, YoungDal Roh, Dong Ju Jeon | 2018-11-20 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2018-06-12 |