Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083903 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | DeokKyung Yang, Sungmin Song | 2018-09-25 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |
| 9905491 | Interposer substrate designs for semiconductor packages | DeokKyung Yang, SeongHun Mun | 2018-02-27 |