Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083903 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | In Sang Yoon, DeokKyung Yang | 2018-09-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083903 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | In Sang Yoon, DeokKyung Yang | 2018-09-25 |