BH

Byung Joon Han

SC Stats Chippac: 2 patents #13 of 69Top 20%
📍 Singapore, NJ: #1 of 5 inventorsTop 20%
Overall (2018): #162,017 of 503,207Top 35%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9997468 Integrated circuit packaging system with shielding and method of manufacturing thereof Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more 2018-06-12
9934998 Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy Il Kwon Shim, Won Kyoung Choi 2018-04-03