Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859200 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | SooSan Park, Kyusang Kim, YeoChan Ko, HeeJo Chi, HeeSoo Lee | 2018-01-02 |