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Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP |
Yaojian Lin |
2018-11-27 |
| 10115672 |
Double-sided semiconductor package and dual-mold method of making same |
Il Kwon Shim, Yaojian Lin |
2018-10-30 |
| 10115701 |
Semiconductor device and method of forming conductive vias by backside via reveal with CMP |
Xing Zhao, Duk Ju Na, Siew Joo Tan |
2018-10-30 |
| 10049964 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units |
Il Kwon Shim, Yaojian Lin, Kang Chen, Yu Gu |
2018-08-14 |
| 9978665 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units |
Il Kwon Shim, Yaojian Lin, Won Kyoung Choi |
2018-05-22 |
| 9893017 |
Double-sided semiconductor package and dual-mold method of making same |
Il Kwon Shim, Yaojian Lin |
2018-02-13 |
| 9865524 |
Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation |
Duk Ju Na, Chang Beom Yong |
2018-01-09 |
| 9865525 |
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units |
Yaojian Lin, Kang Chen, Yu Gu |
2018-01-09 |