Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115701 | Semiconductor device and method of forming conductive vias by backside via reveal with CMP | Xing Zhao, Siew Joo Tan, Pandi C. Marimuthu | 2018-10-30 |
| 9865524 | Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation | Chang Beom Yong, Pandi C. Marimuthu | 2018-01-09 |