Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115701 | Semiconductor device and method of forming conductive vias by backside via reveal with CMP | Xing Zhao, Duk Ju Na, Pandi C. Marimuthu | 2018-10-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115701 | Semiconductor device and method of forming conductive vias by backside via reveal with CMP | Xing Zhao, Duk Ju Na, Pandi C. Marimuthu | 2018-10-30 |