YG

Yu Gu

SC Stats Chippac: 3 patents #9 of 69Top 15%
Overall (2018): #50,567 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
10049964 Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Kang Chen 2018-08-14
9875973 Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Yaojian Lin, Kang Chen, Wei Meng, Chee Siang Ong 2018-01-23
9865525 Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units Yaojian Lin, Pandi C. Marimuthu, Kang Chen 2018-01-09