| 9812294 |
Sub-pulsing during a state |
John C. Valcore, Jr., Bradford J. Lyndaker |
2017-11-07 |
| 9805941 |
Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) |
Keren Jacobs Kanarik, Jeffrey Marks, Samantha Tan, Alexander Kabansky, Wenbing Yang +3 more |
2017-10-31 |
| 9696640 |
Lithographic apparatus |
Adrianus Hendrik Koevoets, Theodorus Petrus Maria Cadee |
2017-07-04 |
| 9659783 |
High aspect ratio etch with combination mask |
Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Thomas W. Mountsier, Aaron Eppler +2 more |
2017-05-23 |
| 9646861 |
Heating plate with heating zones for substrate processing and method of use thereof |
Keith Gaff, Neil Benjamin, Keith Comendant |
2017-05-09 |
| 9613834 |
Replaceable upper chamber section of plasma processing apparatus |
Leonard J. Sharpless, Michael Kang |
2017-04-04 |
| 9589853 |
Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber |
Monica Titus, Gowri Kamarthy, Yoshie Kimura, Meihua Shen, Baosuo Zhou +2 more |
2017-03-07 |
| 9576811 |
Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) |
Keren Jacobs Kanarik, Jeffrey Marks, Samantha Tan, Alexander Kabansky, Wenbing Yang +3 more |
2017-02-21 |
| 9543171 |
Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element |
Ole Waldmann, Eric A. Pape, Keith Gaff |
2017-01-10 |
