Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837312 | Atomic layer etching for enhanced bottom-up feature fill | Taeseung Kim, Jengyi Yu, Praveen Nalla, Novy Tjokro, Artur Kolics +1 more | 2017-12-05 |
| 9805941 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Keren Jacobs Kanarik, Jeffrey Marks, Harmeet Singh, Alexander Kabansky, Wenbing Yang +3 more | 2017-10-31 |
| 9806252 | Dry plasma etch method to pattern MRAM stack | Taeseung Kim, Wenbing Yang, Jeffrey Marks, Thorsten Lill | 2017-10-31 |
| 9576811 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Keren Jacobs Kanarik, Jeffrey Marks, Harmeet Singh, Alexander Kabansky, Wenbing Yang +3 more | 2017-02-21 |