Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837312 | Atomic layer etching for enhanced bottom-up feature fill | Samantha Tan, Taeseung Kim, Jengyi Yu, Novy Tjokro, Artur Kolics +1 more | 2017-12-05 |
| 9818617 | Method of electroless plating using a solution with at least two borane containing reducing agents | Artur Kolics, Xiaomin Bin, Nanhai Li, Yaxin Wang, Patrick William Little +1 more | 2017-11-14 |
| 9768063 | Dual damascene fill | Artur Kolics, Lie Zhao | 2017-09-19 |
| 9583386 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Kaihan Ashtiani +2 more | 2017-02-28 |
| 9551074 | Electroless plating solution with at least two borane containing reducing agents | Artur Kolics, Xiaomin Bin, Nanhai Li, Yaxin Wang, Patrick William Little +1 more | 2017-01-24 |