Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666524 | Electro-migration enhancing method for self-forming barrier process in copper mettalization | Moosung Chae | 2017-05-30 |
| 9583386 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2017-02-28 |