Issued Patents 2016
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502350 | Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer | Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-11-22 |
| 9472477 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Elbert E. Huang, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin | 2016-10-18 |
| 9472450 | Graphene cap for copper interconnect structures | Christos D. Dimitrakopoulos, Alfred Grill, James B. Hannon, Qinghuang Lin, Deborah A. Neumayer +3 more | 2016-10-18 |
| 9455186 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-09-27 |
| 9431292 | Alternate dual damascene method for forming interconnects | Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-08-30 |
| 9431346 | Graphene-metal E-fuse | Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim, Naftali E. Lustig +1 more | 2016-08-30 |
| 9425144 | Metal fuse structure for improved programming capability | Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +2 more | 2016-08-23 |
| 9406560 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-08-02 |
| 9385038 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-07-05 |
| 9360525 | Stacked via structure for metal fuse applications | Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig, Andrew H. Simon +1 more | 2016-06-07 |
| 9324655 | Modified via bottom for beol via efuse | Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-04-26 |
| 9293412 | Graphene and metal interconnects with reduced contact resistance | Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-03-22 |
| 9287185 | Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variations | Baozhen Li, Barry P. Linder, James H. Stathis, Ernest Y. Wu, Kai Zhao | 2016-03-15 |
| 9257391 | Hybrid graphene-metal interconnect structures | Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-02-09 |