Issued Patents 2011
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080479 | Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator | Kenneth S. Collins, Hiroji Hanawa, Douglas A. Buchberger, Jr., Shahid Rauf, Kallol Bera +10 more | 2011-12-20 |
| 8076247 | Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes | Kenneth S. Collins, Hiroji Hanawa, Douglas A. Buchberger, Jr., Shahid Rauf, Kallol Bera +10 more | 2011-12-13 |
| 8058156 | Plasma immersion ion implantation reactor having multiple ion shower grids | Hiroji Hanawa, Tsutomu Tanaka, Kenneth S. Collins, Amir Al-Bayati, Andrew Nguyen | 2011-11-15 |
| 8018164 | Plasma reactor with high speed plasma load impedance tuning by modulation of different unmatched frequency sources | Steven C. Shannon, Daniel J. Hoffman, Matthew L. Miller, Kenneth S. Collins | 2011-09-13 |
| 8002945 | Method of plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power RF generator | Steven C. Shannon, Daniel J. Hoffman, Matthew L. Miller, Kenneth S. Collins | 2011-08-23 |
| 7994872 | Apparatus for multiple frequency power application | Steven C. Shannon, Jang-Gyoo Yang, Matthew L. Miller, James P. Cruse | 2011-08-09 |
| 7989329 | Removal of surface dopants from a substrate | Kenneth S. Collins, Biagio Gallo, Hiroji Hanawa, Majeed A. Foad, Martin A. Hilkene +2 more | 2011-08-02 |
| 7988815 | Plasma reactor with reduced electrical skew using electrical bypass elements | Shahid Rauf, Kenneth S. Collins, Kallol Bera, Hiroji Hanawa, Andrew Nguyen +5 more | 2011-08-02 |
| 7968469 | Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity | Kenneth S. Collins, Hiroji Hanawa, Douglas A. Buchberger, Jr., Shahid Rauf, Kallol Bera +10 more | 2011-06-28 |
| 7968439 | Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces | Shijian Li, Hiroji Hanawa, Seon-Mee Cho, Biagio Gallo, Dongwon Choi +1 more | 2011-06-28 |
| 7967996 | Process for wafer backside polymer removal and wafer front side photoresist removal | Kenneth S. Collins, Hiroji Hanawa, Andrew Nguyen, Shahid Rauf, Ajit Balakrishna +6 more | 2011-06-28 |
| 7967944 | Method of plasma load impedance tuning by modulation of an unmatched low power RF generator | Steven C. Shannon, Daniel J. Hoffman, Matthew L. Miller, Kenneth S. Collins | 2011-06-28 |
| 7884025 | Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Douglas A. Buchberger, Jr., Shahid Rauf, Kallol Bera +10 more | 2011-02-08 |
| 7879731 | Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Douglas A. Buchberger, Jr., Shahid Rauf, Kallol Bera +10 more | 2011-02-01 |