Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080479 | Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Shahid Rauf, Kallol Bera +10 more | 2011-12-20 |
| 8076247 | Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Shahid Rauf, Kallol Bera +10 more | 2011-12-13 |
| 8074677 | Method and apparatus for controlling gas flow to a processing chamber | Ezra Robert Gold, Richard Fovell, James P. Cruse, Jared Ahmad Lee, Bruno Geoffrion +1 more | 2011-12-13 |
| 8034180 | Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor | Paul Brillhart, Richard Fovell, Douglas H. Burns, Kallol Bera, Daniel J. Hoffman | 2011-10-11 |
| 8021521 | Method for agile workpiece temperature control in a plasma reactor using a thermal model | Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas H. Burns, Kallol Bera +5 more | 2011-09-20 |
| 8012304 | Plasma reactor with a multiple zone thermal control feed forward control apparatus | Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas H. Burns, Kallol Bera +1 more | 2011-09-06 |
| 7988872 | Method of operating a capacitively coupled plasma reactor with dual temperature control loops | Paul Brillhart, Richard Fovell, Douglas H. Burns, Kallol Bera, Daniel J. Hoffman +4 more | 2011-08-02 |
| 7972467 | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor | Kallol Bera, Yan Ye, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon | 2011-07-05 |
| 7968469 | Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Shahid Rauf, Kallol Bera +10 more | 2011-06-28 |
| 7884025 | Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Shahid Rauf, Kallol Bera +10 more | 2011-02-08 |
| 7879731 | Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Shahid Rauf, Kallol Bera +10 more | 2011-02-01 |