Issued Patents 2005
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6976902 | Chemical mechanical polishing apparatus | Ja-Eung Koo, Jong Won Lee, Sung Bae Lee, Duk-Ho Hong, Hong-Seong Son | 2005-12-20 |
| 6930054 | Slurry composition for use in chemical mechanical polishing of metal wiring | Jae Seok Lee, Won Joong Do, Hyun Soo Roh, Kil Sung Lee, Jong Won Lee +3 more | 2005-08-16 |
| 6924207 | Method of fabricating a metal-insulator-metal capacitor | Hong-Seong Son, Ja-Eung Koo | 2005-08-02 |
| 6924228 | Method of forming a via contact structure using a dual damascene technique | Il-Goo Kim | 2005-08-02 |
| 6924234 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper | Ja-Hyung Han, Hong-Seong Son, Duk-Ho Hong, Byung-Lyul Park | 2005-08-02 |
| 6914001 | Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same | Jong Won Lee, Jae-Dong Lee, Bo-Un Yoon | 2005-07-05 |
| 6860277 | Single type of semiconductor wafer cleaning device | Kun-Tack Lee, Yong-Pil Han | 2005-03-01 |
| 6855267 | Chemical mechanical polishing slurry | Jae-Dong Lee, Bo-Un Yoon | 2005-02-15 |
| 6843257 | Wafer cleaning system | In-jun Yeo, Kyung-Hyun Kim, Jeong-Lim Nam, Byoung-Moon Yoon, Hyun Ho Cho | 2005-01-18 |