Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6924234 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper | Ja-Hyung Han, Sang-rok Hah, Hong-Seong Son, Duk-Ho Hong | 2005-08-02 |