Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6924228 | Method of forming a via contact structure using a dual damascene technique | Sang-rok Hah | 2005-08-02 |
| 6849536 | Inter-metal dielectric patterns and method of forming the same | Soo-geun Lee, Ju-Hyuk Chung, Kyoung-Woo Lee, Wan Jae Park, Jae Hak Kim | 2005-02-01 |