Issued Patents 2005
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6976906 | Apparatus for reducing compressed dry air usage during chemical mechanical planarization | John M. Boyd, David Wei | 2005-12-20 |
| 6951624 | Method and apparatus of arrayed sensors for metrological control | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2005-10-04 |
| 6951503 | System and method for in-situ measuring and monitoring CMP polishing pad thickness | Simon McClachie | 2005-10-04 |
| 6937915 | Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control | Rodney Kistler, David Hemker, Aleksander Owczarz, Bruno Morel, Damon Vincent Williams | 2005-08-30 |
| 6935938 | Multiple-conditioning member device for chemical mechanical planarization conditioning | Robert Charatan | 2005-08-30 |
| 6929531 | System and method for metal residue detection and mapping within a multi-step sequence | Aleksander Owczarz, David Hemker, Nicolas Bright, Rodney Kistler | 2005-08-16 |
| 6925348 | Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control | Rodney Kistler, David Hemker, Aleksander Owczarz, Bruno Morel, Damon Vincent Williams | 2005-08-02 |
| 6922053 | Complementary sensors metrological process and method and apparatus for implementing the same | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2005-07-26 |
| 6896596 | Polishing pad ironing system | Aleksander Owczarz, Rodney Kistler | 2005-05-24 |
| 6894491 | Method and apparatus for metrological process control implementing complementary sensors | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2005-05-17 |
| 6878048 | CMP belt stretch compensation apparatus and methods for using the same | David Wei, Aleksander Owzarz | 2005-04-12 |
| 6869337 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | John M. Boyd, Rod Kistler | 2005-03-22 |
| 6866567 | Activated slurry CMP system and methods for implementing the same | — | 2005-03-15 |
| 6859765 | Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection | Vladimir Katz, David Hemker, Rodney Kistler, Nicolas Bright | 2005-02-22 |