Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6960519 | Interconnect structure improvements | Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino, Lee M. Nicholson, Anthony K. Stamper | 2005-11-01 |
| 6958540 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Michael Lane | 2005-10-25 |
| 6949461 | Method for depositing a metal layer on a semiconductor interconnect structure | Sandra G. Malhotra | 2005-09-27 |
| 6924223 | Method of forming a metal layer using an intermittent precursor gas flow process | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Mitsuhiro Tachibana +6 more | 2005-08-02 |