Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Fen F. Jamin, Steffen K. Kaldor +11 more | 2005-12-13 |
| 6946716 | Electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Harikilia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans +4 more | 2005-09-20 |