Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2005-12-13 |
| 6964604 | Fiber embedded polishing pad | Shyng-Tsong Chen, Oscar K. Hsu, Kenneth P. Rodbell, Jean Vangsness | 2005-11-15 |
| 6911378 | Stabilization of fluorine-containing dielectric materials in a metal insulator wiring structure | Richard A. Conti, John A. Fitzsimmons, David L. Rath, Daewon Yang | 2005-06-28 |