JF

John A. Fitzsimmons

IBM: 9 patents #55 of 5,214Top 2%
Infineon Technologies Ag: 2 patents #199 of 1,152Top 20%
📍 Poughkeepsie, NY: #1 of 198 inventorsTop 1%
🗺 New York: #71 of 8,003 inventorsTop 1%
Overall (2005): #1,471 of 245,428Top 1%
9
Patents 2005

Issued Patents 2005

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
6960519 Interconnect structure improvements Timothy J. Dalton, Jeffrey P. Gambino, Lee M. Nicholson, Andrew H. Simon, Anthony K. Stamper 2005-11-01
6939797 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Edward Barth, Stephen M. Gates, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more 2005-09-06
6917108 Reliable low-k interconnect structure with hybrid dielectric Stephen E. Greco, Jia Lee, Stephen M. Gates, Terry A. Spooner, Matthew S. Angyal +3 more 2005-07-12
6914320 Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, Terence L. Kane, Naftall E. Lustig, Ann McDonald +5 more 2005-07-05
6911378 Stabilization of fluorine-containing dielectric materials in a metal insulator wiring structure Richard A. Conti, Kenneth M. Davis, David L. Rath, Daewon Yang 2005-06-28
6887783 Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, Terence L. Kane, Naftall E. Lustig, Ann McDonald +5 more 2005-05-03
6864180 Method for reworking low-k polymers used in semiconductor structures Darryl D. Restaino, Delores Bennett, John Fritche, Jeffrey Hedrick, Chih-Chien Liu +2 more 2005-03-08
6849563 Method and apparatus for controlling coating thickness Edward Barth, Arthur Winston Martin, Lee M. Nicholson 2005-02-01
6838355 Damascene interconnect structures including etchback for low-k dielectric materials Anthony K. Stamper, Edward C. Cooney, III, Jeffrey P. Gambino, Timothy J. Dalton, Lee M. Nicholson 2005-01-04