Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2005-12-13 |
| 6960519 | Interconnect structure improvements | John A. Fitzsimmons, Jeffrey P. Gambino, Lee M. Nicholson, Andrew H. Simon, Anthony K. Stamper | 2005-11-01 |
| 6933191 | Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors | Glenn A. Biery, Zheng Chen, Naftali E. Lustig | 2005-08-23 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Christopher V. Jahnes, Andrew Lu, Chandrasekhar Narayan +3 more | 2005-08-09 |
| 6924185 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Christopher V. Jahnes, Andrew Lu, Chandrasekhar Narayan +3 more | 2005-08-02 |
| 6873027 | Encapsulated energy-dissipative fuse for integrated circuits and method of making the same | Kevin S. Petrarca, Richard P. Volant | 2005-03-29 |
| 6869895 | Method for adjusting capacitance of an on-chip capacitor | Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang | 2005-03-22 |
| 6838355 | Damascene interconnect structures including etchback for low-k dielectric materials | Anthony K. Stamper, Edward C. Cooney, III, Jeffrey P. Gambino, John A. Fitzsimmons, Lee M. Nicholson | 2005-01-04 |