Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6962872 | High density chip carrier with integrated passive devices | Michael P. Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce K. Furman, Rajarao Jammy +3 more | 2005-11-08 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-09 |
| 6924185 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-02 |
| 6856025 | Chip and wafer integration process using vertical connections | H. Bernhard Pogge, Roy Yu, Chandrika Prasad | 2005-02-15 |