AM

Ann McDonald

IBM: 3 patents #481 of 5,214Top 10%
Infineon Technologies Ag: 2 patents #199 of 1,152Top 20%
📍 New Windsor, NY: #1 of 13 inventorsTop 8%
🗺 New York: #598 of 8,003 inventorsTop 8%
Overall (2005): #26,716 of 245,428Top 15%
3
Patents 2005

Issued Patents 2005

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6939797 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane +3 more 2005-09-06
6914320 Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more 2005-07-05
6887783 Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Terence L. Kane, Naftall E. Lustig +5 more 2005-05-03