Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6914320 | Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Naftall E. Lustig, Ann McDonald +5 more | 2005-07-05 |
| 6894522 | Specific site backside underlaying and micromasking method for electrical characterization of semiconductor devices | Barbara A. Averill, Darrell L. Miles, Richard W. Oldrey, John D. Sylvestri | 2005-05-17 |
| 6887783 | Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof | Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Naftall E. Lustig, Ann McDonald +5 more | 2005-05-03 |
| 6888224 | Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials | Michael P. Tenney | 2005-05-03 |
| 6884641 | Site-specific methodology for localization and analyzing junction defects in mosfet devices | John Bruley, Michael P. Tenney, Yun-Yu Wang | 2005-04-26 |
| 6858530 | Method for electrically characterizing charge sensitive semiconductor devices | Lawrence Fischer, Steven B. Herschbein, Ying Hong, Michael P. Tenney | 2005-02-22 |
| 6852629 | Backside integrated circuit die surface finishing technique and tool | Darrell L. Miles | 2005-02-08 |