Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Keith Kwietniak, Sandra G. Malhotra +4 more | 2005-12-13 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Ernest N. Levine +8 more | 2005-12-06 |
| 6958540 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Andrew H. Simon | 2005-10-25 |