Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Keith Kwietniak, Michael Lane +4 more | 2005-12-13 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6949461 | Method for depositing a metal layer on a semiconductor interconnect structure | Andrew H. Simon | 2005-09-27 |
| 6924223 | Method of forming a metal layer using an intermittent precursor gas flow process | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Mitsuhiro Tachibana +6 more | 2005-08-02 |
| 6909772 | Method and apparatus for thin film thickness mapping | Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Patrick W. DeHaven +1 more | 2005-06-21 |