Issued Patents 2002
Showing 1–25 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501165 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Alan G. Wood, Mike Brooks | 2002-12-31 |
| 6491574 | Complete blade and wafer handling and support system without tape | — | 2002-12-10 |
| 6492187 | Method for automatically positioning electronic die within component packages | Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6492728 | Vertical surface mount assembly | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2002-12-10 |
| 6492738 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2002-12-10 |
| 6489183 | Method of manufacturing a taped semiconductor device | — | 2002-12-03 |
| 6482576 | Surface smoothing of stereolithographically formed 3-D objects | Kevin G. Duesman | 2002-11-19 |
| 6478627 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2002-11-12 |
| 6477662 | Apparatus and method implementing repairs on a memory device | Ray Beffa, William K. Waller, Lee R. Nevill, Eugene H. Cloud | 2002-11-05 |
| 6469537 | System for testing semiconductor wafers having interconnect with pressure sensing mechanism | Salman Akram | 2002-10-22 |
| 6465877 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Alan G. Wood, Mike Brooks | 2002-10-15 |
| 6462571 | Engagement probes | Malcolm Grief, Gurtej S. Sandhu | 2002-10-08 |
| 6461881 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Alan G. Wood | 2002-10-08 |
| 6453550 | Method for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2002-09-24 |
| 6455351 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2002-09-24 |
| 6453377 | Computer including optical interconnect, memory unit, and method of assembling a computer | Alan G. Wood | 2002-09-17 |
| 6452415 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2002-09-17 |
| 6451624 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Alan G. Wood, Mike Brooks | 2002-09-17 |
| 6446334 | Heat transfer material for an improved die edge contacting socket | — | 2002-09-10 |
| 6443350 | Continuous mode solder jet apparatus | — | 2002-09-03 |
| 6441628 | CSP BGA test socket with insert and method | Derek Gochnour, David R. Hembree | 2002-08-27 |
| 6442044 | Semiconductor device socket, assembly and methods | Larry D. Kinsman, Walter L. Moden | 2002-08-27 |
| 6437591 | Test interconnect for bumped semiconductor components and method of fabrication | Salman Akram | 2002-08-20 |
| 6437435 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Walter L. Moden | 2002-08-20 |
| 6437451 | Test interconnect for semiconductor components having bumped and planar contacts | Salman Akram | 2002-08-20 |