Issued Patents 2002
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492728 | Vertical surface mount assembly | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2002-12-10 |
| 6486546 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2002-11-26 |
| 6475831 | Methods for a low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2002-11-05 |
| 6465275 | Method of forming a stack of packaged memory die and resulting apparatus | Jerrold L. King | 2002-10-15 |
| 6457985 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2002-10-01 |
| 6455351 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2002-09-24 |
| 6455928 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2002-09-24 |
| 6445060 | Coated semiconductor die/leadframe assembly and method for coating the assembly | Robert Courtenay | 2002-09-03 |
| 6445063 | Method of forming a stack of packaged memory die and resulting apparatus | Jerrold L. King | 2002-09-03 |
| 6445067 | Integrated circuit package electrical enhancement | David J. Corisis | 2002-09-03 |
| 6438045 | Redundancy mapping in a multichip semiconductor package | Jerrold L. King | 2002-08-20 |
| 6429528 | Multichip semiconductor package | Jerrold L. King | 2002-08-06 |
| 6418023 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Walter L. Moden | 2002-07-09 |
| 6404044 | Semiconductor package with stacked substrates and multiple semiconductor dice | Salman Akram | 2002-06-11 |
| 6398573 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2002-06-04 |
| 6396131 | Stress reduction feature for LOC lead frame | Larry D. Kinsman, Timothy J. Allen | 2002-05-28 |
| 6368136 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2002-04-09 |
| 6362022 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, David J. Corisis | 2002-03-26 |
| 6362519 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2002-03-26 |
| 6344976 | Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die | Aaron Schoenfeld | 2002-02-05 |