Issued Patents 2002
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 2002-12-03 |
| 6486546 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2002-11-26 |
| 6475831 | Methods for a low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2002-11-05 |
| 6465275 | Method of forming a stack of packaged memory die and resulting apparatus | Jerry M. Brooks | 2002-10-15 |
| 6445063 | Method of forming a stack of packaged memory die and resulting apparatus | Jerry M. Brooks | 2002-09-03 |
| 6438045 | Redundancy mapping in a multichip semiconductor package | Jerry M. Brooks | 2002-08-20 |
| 6429528 | Multichip semiconductor package | Jerry M. Brooks | 2002-08-06 |
| 6420214 | Method of forming an integrated circuit device having cyanate ester buffer coat | J. Mike Brooks, Kevin Schofield | 2002-07-16 |
| 6420195 | Method of aligning and testing a semiconductor chip package | Leland R. Nevill | 2002-07-16 |
| 6410859 | Electrical assembly for semiconductor dice | — | 2002-06-25 |
| 6362519 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2002-03-26 |