Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 2002-12-03 |
| 6420214 | Method of forming an integrated circuit device having cyanate ester buffer coat | Jerrold L. King, Kevin Schofield | 2002-07-16 |
| 6362532 | Semiconductor device having ball-bonded pads | Alan G. Wood, Kevin G. Duesman | 2002-03-26 |