Issued Patents 2002
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501165 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Mike Brooks | 2002-12-31 |
| 6498503 | Semiconductor test interconnect with variable flexure contacts | Salman Akram | 2002-12-24 |
| 6492738 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2002-12-10 |
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6472239 | Method for fabricating semiconductor components | David R. Hembree | 2002-10-29 |
| 6469532 | Apparatus for forming coaxial silicon interconnects | Salman Akram, David R. Hembree | 2002-10-22 |
| 6465877 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Warren M. Farnworth, Mike Brooks | 2002-10-15 |
| 6461881 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Warren M. Farnworth | 2002-10-08 |
| 6453377 | Computer including optical interconnect, memory unit, and method of assembling a computer | Warren M. Farnworth | 2002-09-17 |
| 6451624 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Mike Brooks | 2002-09-17 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2002-08-06 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2002-07-16 |
| 6413102 | Center bond flip chip semiconductor carrier and a method of making and using it | Tongbi Jiang | 2002-07-02 |
| 6414506 | Interconnect for testing semiconductor dice having raised bond pads | Salman Akram, Warren M. Farnworth | 2002-07-02 |
| 6404063 | Die-to-insert permanent connection and method of forming | Warren M. Farnworth | 2002-06-11 |
| 6400172 | Semiconductor components having lasered machined conductive vias | Salman Akram, Warren M. Farnworth | 2002-06-04 |
| 6396291 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Derek Gochnour, John O. Jacobson | 2002-05-28 |
| 6392430 | Method of forming coaxial silicon interconnects | Salman Akram, David R. Hembree | 2002-05-21 |
| 6392429 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Warren M. Farnworth, Salman Akram | 2002-05-21 |
| 6387714 | Die-to-insert permanent connection and method of forming | Warren M. Farnworth | 2002-05-14 |
| 6383825 | Method and system for testing semiconductor dice, semiconductor packages and semiconductor wafers | Warren M. Farnworth | 2002-05-07 |
| 6380632 | Center bond flip-chip semiconductor device and method of making it | Tongbi Jiang | 2002-04-30 |
| 6368896 | Method of wafer level chip scale packaging | Warren M. Farnworth, Mike Brooks | 2002-04-09 |
| 6364196 | Method and apparatus for aligning and attaching balls to a substrate | Salman Akram, Mike Hess, David R. Hembree | 2002-04-02 |
| 6362532 | Semiconductor device having ball-bonded pads | J. Mike Brooks, Kevin G. Duesman | 2002-03-26 |