Issued Patents 2002
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501170 | Substrates and assemblies including pre-applied adhesion promoter | Brenton L. Dickey | 2002-12-31 |
| 6492713 | Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2002-12-10 |
| 6489681 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Syed Sajid Ahmad | 2002-12-03 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Walter L. Moden, Syed Sajid Ahmad, Gregory M. Chapman | 2002-11-26 |
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2002-10-29 |
| 6465314 | Semiconductor processing methods | David Y. Kao | 2002-10-15 |
| 6458624 | Resistance-reducing conductive adhesives for attachment of electronic components | Whonchee Lee | 2002-10-01 |
| 6455923 | Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices | Walter L. Moden | 2002-09-24 |
| 6455354 | Method of fabricating tape attachment chip-on-board assemblies | — | 2002-09-24 |
| 6451116 | Apparatus for electroless plating a contact pad | Li Li | 2002-09-17 |
| 6452271 | Interconnect component for a semiconductor die including a ruthenium layer and a method for its fabrication | Li Li | 2002-09-17 |
| 6440777 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Chad A. Cobbley, John VanNortwick | 2002-08-27 |
| 6426552 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS | W. Jeff Reeder | 2002-07-30 |
| 6423579 | Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices | Walter L. Moden | 2002-07-23 |
| 6414869 | Quad in-line memory module | David Y. Kao | 2002-07-02 |
| 6413102 | Center bond flip chip semiconductor carrier and a method of making and using it | Alan G. Wood | 2002-07-02 |
| 6406944 | Method of fabricating a reinforcement of lead bonding in microelectronic packages | — | 2002-06-18 |
| 6388199 | Selectively adjusting surface tension of soldermask material | Partrick Tandy | 2002-05-14 |
| 6380632 | Center bond flip-chip semiconductor device and method of making it | Alan G. Wood | 2002-04-30 |
| 6380626 | Semiconductor device for attachment to a semiconductor substrate | — | 2002-04-30 |
| 6367685 | Ultrasonic vibration mode for wire bonding | Zhiqiang Wu | 2002-04-09 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Bret K. Street | 2002-04-09 |
| 6368897 | Method for manufactoring and using stencil/screen | Chad A. Cobbley, John VanNortwick | 2002-04-09 |
| 6363796 | High resolution pressure-sensing device having an insulating flexible matrix loaded with filler particles | Zhiqiang Wu | 2002-04-02 |
| 6365842 | Electrical circuits, circuits, and electrical couplings | — | 2002-04-02 |