Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500697 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes | — | 2002-12-31 |
| 6492713 | Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2002-12-10 |
| 6489681 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2002-12-03 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2002-11-26 |
| 6483044 | Interconnecting substrates for electrical coupling of microelectronic components | — | 2002-11-19 |
| 6436732 | Apparatus for applying viscous materials to a lead frame | — | 2002-08-20 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2002-03-05 |
| 6346152 | Method and apparatus for applying adhesives to a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2002-02-12 |
| 6336973 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2002-01-08 |
| 6336974 | Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid | — | 2002-01-08 |