Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501170 | Substrates and assemblies including pre-applied adhesion promoter | Tongbi Jiang | 2002-12-31 |
| 6395579 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more | 2002-05-28 |