Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498052 | Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit | — | 2002-12-24 |
| 6461894 | Methods of forming a circuit and methods of preparing an integrated circuit | — | 2002-10-08 |
| 6423581 | Method of fabricating an encapsulant lock feature in integrated circuit packaging | — | 2002-07-23 |
| 6399425 | Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices | Scott L. Gooch | 2002-06-04 |
| 6395579 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2002-05-28 |
| 6383292 | Semiconductor device encapsulators | Scott L. Gooch | 2002-05-07 |
| 6379991 | Encapsulation methods for semiconductive die packages | Ford B. Grigg | 2002-04-30 |
| 6355506 | Method of forming heat sink and semiconductor chip assemblies | — | 2002-03-12 |
| 6355985 | Integrated circuit device and synchronous-link dynamic random access memory device | — | 2002-03-12 |